Department of Conservative Dentistry, Division of Dentistry, Graduate of Kyung Hee University
Copyright © 2007 The Korean Academy of Conservative Dentistry
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| Type | Adhesives(codes) | Composition | Application mode |
|---|---|---|---|
| 3-step total etching systems | PrimerA:- NTG-GMA (N(p-tolyl)glycine-glycidyl | a, b1, | |
| methacrylate), acetone, ethanol, water | c1, e, f | ||
| Primer B: | |||
| BPDM (biphenyl dimethacrylate), photoinitiator, acetone | |||
| All-Bond 2 | D/E bonding resin: | ||
| (AB) | Bis-GMA (bisphenol A glycidyl methacrylate), | ||
| UDMA(urethane dimethacrylate), HEMA | |||
| (2-Hydroxyethyl methacrylate), | |||
| CQ (camphorquinone) | |||
| Scotchbond | HEMA, Polyalkenoic acid copolymer, | a, b1, | |
| MP (SM) | Bis-GMA | c1, e, f | |
| 2-step total-etching- systems | One-Step (OS) | Bis-GMA, BPDM, HEMA, Acetone, CQ | a, d, |
| c1, e, f | |||
| Single Bond | Bis-GMA, HEMA, Bisphenol A glycerolate | a, d, | |
| (SB) | dimethacrylate, Water, UDMA, Polyalkenoic | c1, e, f | |
| acid copolymer, Ethanol | |||
| 2-step self etching-systems | Clearfil SE | MDP (10-methacryloyloxydecyl dihydrogen phosphate), | b2, d, |
| Bond (SE) | HEMA, N,N-Diethanol p-toluidine, water, Bis-GMA, | c2, e, f | |
| HEMA, N,N-Diethanol p-toluidine, microfiller, CQ | |||
| Phosphoric acid ether acrylate, Hydrolytically stable | b2, d, | ||
| AdheSE(AD) | bisacrylamide, Water, Initiators and stabilizers, | c2, e, f | |
| Bis-GMA, GDMA (glycerol dimethacrylate), HEMA, | |||
| Highly dispersed silica filler | |||
| Single-step self-etching systems | Adper- | Water, stabilizer, parabenes, methacrylated phosphoric | e, d, |
| Prompt | acid esters, fluoride complex, photoinitiator BAPO | c2, f | |
| L-pop (PL) | (bisacylphosphine oxide) | ||
| Xeno III (XE) | Water, ethanol, HEMA, methacryloxyethyl-pyrophosphate, | e, d, | |
| F-releasing phosphazene, UDMA, micro-filler, CQ | c2, f |
| Adhesive\Thermo cycling | 3 step TEA |
2 step TEA |
2 step SEA |
1 step SEA |
||||
|---|---|---|---|---|---|---|---|---|
| SM | AB | OS | SB | SE | AD | PL | XE | |
| Immediate |
34.4 ± 14.4 |
36.4 ± 12.8 |
36.9 ± 14.2c |
36.5 ± 9.9c |
48.5 ± 10.2D |
34.1 ± 16.6B |
24.1 ± 8.4γ |
22.4 ± 7.2γ |
| 1,000 cycles |
39.1 ± 11.1 |
32.1 ± 15.3 |
33.0 ± 14.1b c |
28.4 ± 7.4ab |
44.4 ± 15.0CD |
25.1 ± 6.3A |
21.7 ± 7.9 βγ |
15.5 ± 6.9αβ |
| 2,000 cycles | 35.3 ± 15.0 | 29.6 ± 12.6 | 26.4 ± 10.4ab | 21.0 ± 8.2a | 36.5 ± 10.1BC | 28.0 ± 7.2AB | 18.7 ± 6.9 αβγ | 13.5 ± 9.7α |
a - acid etch for 15 sec and rinse, b1 - primer, b2 - SEP (self-etch primer), c1 - moist surface properly, c2 - dry, d - dwell for 10 – 40 sec, e - adhesive, f - light cure (10sec, 600 mW/cm2
